次世代微处理器散热技术

摘 要

近年來由於晶片製程與資訊技術之進步，電子元件與其線徑越來越小而密集，導致電子元件散熱問題日益凸顯，主要原因為總發熱量提高與單位面積發熱量的增加，造成元件操作溫度提昇，影響電子晶片之正常運作。本文主要針對近年來所發現與探討之問題分析，尋求可能解決之道。並提出目前工研院機械所微系統技術部所研究以蒸汽槽(Vapor Chamber)的方式設計微均熱片(Micro Heat Spreader)作為可能解決方案，包含實驗測試方式與初步實驗結果。期望用以提供次世代微處理器一個適當的散熱技術。

關鍵詞：蒸汽槽 Vapor Chamber,均熱片 Heat Spreader,散熱器 Heat Sink,雙相流 Two-Phase Flow,電子散熱 Electronics Cooling

With the progress of electronic manufacturing process,the heat dissipation issues are getting more and more important recently. The major problems may result from the increasing of total power and heat flux. In this article, we first surveyed the problems and solutions of the cooling issues nowadays; then we proposed our approaching way to these problems, and that is so-called” vapor chamber micro heat spreader”. Including design, equipment, and test results of our micro heat spreader, we wish to propose a possible cooling solution for the next-generation-micro processor.