A heat pipe is an efficient heat transfer device commonly used for cooling an electronic component. A heat pipe is essentially a closed evacuated tube lined with a porous structure call "wick structure" (2 kinds of wick structure heat pipe CCI made, one is "screen mesh" and the other is "grooved"). The wick is saturated with a proper amount of working fluid.

The liquid phase of working fluid contained in the wick structure absorbs \ thermal energy from the heated section and becomes vapor filling the heat pipe chamber. Then the disspation of thermal energy at the condensing section causes the vapor to release latent heat and condense. The condensed working fluid is then sucked back to the evaporating section along the wick structure through the capillary force.

This thermodynamic cycle continues as the thermal energy is transferred from one section of the heat pipe to another. It's noted that will remain small temperature drop as the working fluid goes through the phase change inside the heat pipe chamber.

This thermodynamic cycle continues as the thermal energy is transferred from one section of the heat pipe to another. It's noted that will remain small temperature drop as the working fluid goes through the phase change inside the heat pipe chamber.

Cold Plate (Vapor Chamber) Material: 1020 / 1100 Copper Thickness: 5mm ~ 7mm Size: Customer Design, A >= 50x50mm^2 is recommended Working Fluid: H2O Sealing: Argon welding Function: Solve CPU power density issue on X-Y                        directions. Reduce the thermal resistance                        between CPU  case to Heat Sink block. Application: Be a heat sink block to contact hot surface especially the heat                           source with high power density such as Intel Prescott CPU and                           AMD K8 CPU.
Heat Plate Advantage It can effective direct contact cooling& have compact design for space sensitive         applications. Utilize vapor of body fluid hot to spread way , replace existing warm block ,reduce          spreader thermal resistance ,and then improve the systematic efficiency of          whole heat dissipation.

Heat Column Material: 1020 / 1100 Copper Height: 50mm ~ 130mm diameter: D = 25.4 mm ( 1 in ) Working Fluid: H2O Eivk Dytuvyutr : Powder Sealing: Argon welding Function: Solve CPU power density issue on Z directions,                        Reduce the thermal resistance between CPU  case to                        Heat Sink block. Application: Be a heat sink block to contact hot surface especially                            the heat source with high power density such as                            Intel Prescott CPU and AMD K8 CPU.
Heat Column Advantage Heat column helps to bring heat straight up. It allows maximum heat dissipation in the          vertical direction with minimum footprint. Higher heat flux density. Works under any orientations, e.g., horizontal gravity aided and against gravity          better quality and more reliable. Direct contact with CPU surface. Enable the thermal tower to be very efficient in          transfer the heat away for cooling.