Low Profile Heat Pipe Assembly

• Notebook Computers
• LCD Computers
• VGA Cards
• Desktop Notes
• Servers
• Scientific and Medical Instruments
• Other Compact Electronic Devices

As modern electronic devices getting smaller and hotter, most engineers are challenged by solving problem of cooling large heat load with constrained space.  Low profile heat pipe assemblies are perfect for meeting this challenge.  The heat pipe remove the heat from the heat source to the fin stack where it is dissipated to the environment either by nature convection or forced convection.

Each design is tailored to the specific application. Most of the assemblies are consist of heat sink or metal plate, heat pipe, slim blower, thermal interface material.

Heat sinks can be extruded, die caste, stack fined and the material can be aluminum or copper.
Generally, the overall profile for these kind of assembly is no taller than 20 mm.