Application Specific Designs

Transport Applications
Transport designs can be useful where space is constrained or airflow is not available directly over the device requiring cooling. Examples of application characteristics where transport heat pipes solutions may solve design issues include:

• Limited height or space—Heat pipes can spread the cooling solution volume horizontally rather than vertically to achieve the desired thermal performance.
• Sealed enclosures—Heat pipes could be used to transport the heat from the device to the wall of the enclosure where it can be dissipated to the exterior allowing the enclosure to remain sealed from the elements.
• Obstructed airflow—Obstructions in the chassis may leave insufficient airflow over the device to be cooled. Connecting an evaporator to a remote condenser using a heat pipe allows the condenser to be placed in an area of unobstructed airflow to provide the necessary cooling.

Typical Applications Include:

• Telecommunication equipment
• Computing—servers, desktops and workstations
• Rugged computing