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Cooling Solutions for Notebook Assemblies

晨怡热管 www.aavidthermalloy.com 2007-4-3 18:19:11

Notebook computers present unique thermal challenges, and heat sinks from Aavid Thermalloy can provide complete solutions to meet these challenges. Selection can be made from off-the-shelf components, custom designed parts, or any combination of these.

Design Considerations and Rapid Prototyping
Aavid Thermalloy has worked with numerous notebook suppliers to create successful thermal solutions for popular notebook designs. Each design is a multicomponent solution adapted specifically for the notebook in question, whether it is for a low power or high-end notebook. By working side-by-side with your design team, we can help you meet your deadlines and beat your competition.

Design Considerations Planning for thermal issues at the beginning of the design cycle is the best way to achieve the most effective cooling for your notebook computer design.
Icepak CFD (computational fluid dynamics) software provides a quick, accurate picture of the thermal behavior of a proposed notebook design — before it is manufactured. Thermal modeling software allows a designer to try-out different configurations, easily and rapidly, so that the design can be optimized for thermal performance without the need for expensive prototypes.
Step 1 Layout Often the most effective and least expensive cooling strategy is careful component placement. Keeping hot components in the air stream and keeping the heat-sensitive hard drives away from the processor helps keep system heat within acceptable limits.
Step 2 CPU The CPU generates most of the heat in a notebook PC, so it is extremely important to identify space requirements for the vents, fans, and heat sinks needed to cool the CPU.
Step 3 Chipsets Because chipsets and memory must be cooled by the heat sink, exact modeling is necessary to identify the combined heating effects of multiple components.
Step 4 Peripherals Since the notebook is a closed system, thermal analysis also includes the HDD, CDROM, DC-DC converter, and the battery. Proper management of the entire system affects the final heat sink assembly design.
Step 5 System Analysis Up front analysis of the thermal behavior of the notebook system working as a whole reduces the design cycle time and often eliminates costly prototypes.
Step 6 Rapid Prototyping To get your parts as quickly as you need to meet time-to-market demands, Aavid Thermalloy offers preassembly of the notebook solution, using epoxy or solder. We have in-house plastics capability to provide solutions for mechanical stability.

Technologies Used in Solutions
Use the most efficient heat sink design in combination with thermally conductive interface materials and heat pipes to achieve the ultimate thermal network for your notebook computer design.

Technologies Used The unique cooling constraints of notebook computers require specific technologies such as heat sinks, thermal interface materials, and specialized heat pipes. Frequently the ideal thermal solution is made up of several components working as a thermal network to dissipate unwanted heat.
Heat Sinks Extruded and folded fin heat sinks efficiently remove heat from the notebook assembly. Used in conjunction with proper design and fan selection, these heat sinks allow the optimum thermal performance.
Thermal Network Low durometer interface material makes contact with the CPU module and transfers the heat to the heat sink. A fan moves the heat outside the system - 70% of the total heat dissipates this way. An aluminum plate absorbs the remaining 30% of the heat and transfers it internally to the keyboard and other components. Optimal placement of the vent and fan add to the effectiveness of the thermal performance.
Heat Pipes Aavid Thermalloy offers heat pipes in custom shapes with performance in mind. Each bend or flattening operation reduces the performance of a heat pipe by up to 15%. For the right diameter and the best geometry, contact Aavid Thermalloy's Applications Engineering Department.

Designing a Solution with Aavid Thermalloy
Work with Aavid Thermalloy's cooling experts to design a cooling solution ideally tailored to your application. One major advantage is our ability to combine multiple components into a single solution, where we control both the performance and the specification of the component to meet or exceed the overall assembly performance specification.

Designing a Solution Aavid Thermalloy offers optimum cooling solutions for notebook computers. We design a subassembly around the cooling requirements of each notebook computer. The solution maximizes battery life, while meeting cost, size, and weight constraints.
The typical subassembly consists of a stamped plate that mounts to the back of the keypad, a custom heat pipe, and one or more heat sinks to cool the hottest components. Aavid Thermalloy also recommends the fan type and placement for optimum airflow and longest life. Each cooling solution revolves around the OEM (original equipment manufacturer) requirements.
Design Process OEM contacts Aavid Thermalloy with the design requirements and thermal specifications Aavid Thermalloy uses Icepak^TM from Fluent, Inc. to develop a basic model
IcepakTM Modeling
The model focuses on critical components such as the CPU, hard drive, fan (type and location), and venting Aavid Thermalloy uses the worst case boundary conditions as a basis for the thermal solution To reduce the design cycle, Aavid Thermalloy examines several "what-if" scenarios Using virtual and actual prototyping, Aavid Thermalloy quickly develops a design strategy For a custom cooling solution for your notebook's design, contact our Applications Engineering Department.

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