Cold Plate Technologies

Heat Pipe Assisted Cold Plate Technology

 Heat Pipe Cold Plate technology uses heat pipes embedded in an aluminum plate to provide the necessary high-efficiency heat transfer in space and weight constrained applications. By using heat pipes, the cold plate has the weight of aluminum with an effective thermal conductivity more than four times that of copper. Utilizing flattened heat pipes will permit a very low profile design. The cold plate is capable of operating in harsh environments including high altitude, extreme temperatures/humidity, shock and vibration.

Liquid-Cooled Cold Plate Technology

 Thermacore manufactures a variety of water-cooled cold plates to cool high-power semiconductors that require high rates of heat removal by using low water flow. Utilizing micro-channel or powder metal technologies, our custom water-cooled assemblies can be designed specifically to your requirements. These designs provide the optimum performance for a given application.