Heat sinks cut weight in half

Aluminum pin-fin, copper-plate construction enables high performance over a variety of sizes

Comprising an array of forged aluminum pin-fins reflowed onto a copper plate, a line of hybrid copper/aluminum heat sinks reduces weight by up to 50% compared with standard copper pin-fin devices. The heat sinks are available with thermal resistances from 0.05 to 2.25°C/W at 400 lfm, and are designed for air speeds from 100 to 400 lfm to suit applications requiring large, low-profile cooling such as semiconductors, multidevice cooling in SMT environments, and embedded applications.

The heat sinks are offered in pin counts from 242 to 3,600, and come in footprints from 1.5 x 3.0 in. to 8.2 x 8.2 in. with heights from 0.3 to 1.3 in. (From $15 — available now.)