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Thermal Design for NOTEBOOK PC by using thermal analysis

晨怡热管 LG Electronics Inc., LG Production Research center Man-In Baek*, Jung-Mi Lee 2008-2-13 9:37:33

Key word : Thermal design, RHE(Remote Heat Exchanger), Thermal analysis, PCB(Printed circuit board),
Abstract
The portable personal computer is more popular than ever. On the other hand, the power dissipation of notebook PC is higher. So many portable personal computer makers have a problem in thermal management. In this paper, we will review the various thermal enhancements from the component, board,
and system level for the use of the Pentium processor in the ball grid array(BGA) in notebook PC. CFD
and heat transfer simulations are applied to the layout design of the notebook PC. The CPU location is decided by the result of optimization of the fan and inlet air ventilation. To escape hot spots in the outcase we suggested Magnesium. And to maintain the device temperature and the surface temperature of the enclosure within limits, the thermal models have been developed for compact simulation and equivalent accuracy with experiments.

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