When considering the cooling of electronic components we can simplify the objectives as follows:
Reduce overall electronics cost,
Reduce the application's required component rating,
Increase commutated power,
Improved long term reliability.
To illustrate this, consider the following example. An electronic surface mount component is placed on the cooling device, as seen in the previous schematic.
If we define an equivalent heat exchange coefficient , Heq, as follows:
to summarize, the higher the Heq the more efficient the cooling device.
A higher Heq can bring success in reaching our objectives.
The table on the right shows a relative comparison of Ferraz Shawmut Thermal Management solutions applying Heq values.
Also see each specific data sheet which indicates relative Heq characteristics.
Note that: 
Comparing Thermal performance : The solutions
Classification based on Heq
| Product |
Cooling
Source |
Cooling
Type |
Material |
Applied
Technology |
Application |
Radiacal®
Fabfin |
Air
|
Heat Sink
|
Aluminum
(Copper)
|
Extruded Aluminum
Assembly by Swaging
|
Cooling of all types of
microelectronics
components
|
Radiacal®
Corrugated |
Air
|
Heat Sink
|
Aluminum
|
Soldered or bonded
Corrugated channels
|
Cooling of all types of
components with press
or surface mounting
|
| Transcal® |
Air
|
Heat Pipe
|
Aluminum
(Copper)
|
Copper tube with water,
Methanol, fluorocarbon
|
Cooling of all types of components,
ideal for sealed enclosures.
Electrical isolation added feature
|
| Calitube |
Water
|
Cold Plate
|
Aluminum
Copper,
Staimless Steel
|
Stainless steel or copper
tubing inserted into an
aluminum block
|
Cooling of all types of components,
with press pack or
surface mounting
|
| Calistor® |
Water
|
Cold Plate
|
Aluminum
Copper
|
Aluminum - multiple
layers vacuum brazed /
Copper plates brazed
|
Specifically designed for
press pack applications
|
| Moducal® |
Water
|
Cold Plate
|
Aluminum
Copper
|
Same as Calistor®
|
Ideal for surface mounted
modular components
|
| Multical® |
Water
|
Cold Plate
|
Aluminum
|
Aluminum Plates
machined
and vacuum brazed
|
Specifically engineered
perapplication of anysurface
mounted component
|
|
