LED 焊接方法
- 注意各类器件外线的排列,以防极性装错。器件不可与发热元件靠得太近,工作条件不要超过其规定的极限。
- 务必不要在引脚变形的情况下安装LED。
- 当决定在孔中安装时,计算好面孔及线路板上孔距的尺寸和公差以免支架受过度的压力。4)安装LED时,建意用导套定位。
- 在焊接温度回到正常以前,必须避免使LED受到任何的震动或外力
- 请勿用有机溶剂(如丙酮、天那水等)清洗或擦拭发光管胶体,使得环氧树酯表面粗化,造成发光 不正常或者胶体内部破裂,导致发光管内部金丝与芯片或芯片与支架的连接破坏,造成不发光或发光不 正常;发光二极管的管脚外表为镀银或镀锡,请勿破坏其表面镀层,以免造成氧化过快。如必须清洁,请用酒精清洁不超过一分钟,强烈建议用超声波清洗发光二极管。
- LED在弯脚或折脚时请不要离胶体太近或紧靠LED的胶体,应与胶体边缘保持2mm以上的距离,否则会使LED胶体里面胶体与金线分离;管脚在同一处的折叠次数不能太多
- 烙铁焊接:烙铁(最高30W)尖端温度不超过300℃;焊接时间不超过3秒;焊接位置至少离胶体2毫米。
- 浸焊:浸焊最高温度260℃;浸焊时间不超过5秒;浸焊位置至少离胶体2毫米。
- 请勿带电作业。
- 由于LED具有随着电压稍加而电流迅速增加之特性,过高的电流会引起LED灯的烧坏及亮度的超速衰减,应加上一个电阻与LED串联,起到限流作用,LEDs应在相同的电流条件下工作,一般建议通LED之电流为20mA.
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SAMPLING PLAN
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U.S. Ministry of defence MIL-STD-105E level II (Single Sample Plans)
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INSPECTION ITEMS AND CRITERION FOR JUDGEMENT
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Measuring Methods for Light Emitting Diodes (No. 11830) and Light Emitting Diodes (No.11829).
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Stipulated by Ministry of Economical Affairs of R.O.C. and by reference to QC standards prevailing in prominent LED plants worldwide.
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RELIABILITY TESTS
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General Provisions for Environmental Tests of CNS-Categorized Electronics Parts, 3623-3634, 567, 11233-11238, and U.S. Ministry of National Defence MIL-STD-750 Specifications.
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TEST
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CONDITIONS
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THERMAL SHOCK
TEST |
LED placed in a chamber (-44°C) for 20 minutes, temperature increased instantaneously to + 88°C for 20 minutes.The duration of the test shall be for 10 complete cycles.
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HUMIDITY
TEST |
LED placed in humidity chamber which is maintained at 40°C, 95% R.H.The duration of test is for 96 hours.
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LIFE
TEST |
LED connected to a source of power and charged with 10mA at room temperature (25°C) for 1000 hours.
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SOLDER
ABILITY TEST |
The pins of LED (1.6mm from body) dipped into tin which is maintained at 260°C with +/- 5°C.
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VIBRATION
TEST |
LED placed on a vibrator which is maintained at 10-55-10 Hz/minute. 0.82mm amplitude. The duration of the test is 30 minutes.
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PACKING
TEST |
LED packed in a corrugated fibreboard box and fallen freely on 6 faces at a diagonal angle to the ground. The altitude of the fall will be in the range of 229-609 mm considering of the packed product.
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MEASURING TERMS
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FAILURE CRITERIA
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LUMINOUS INTENSITY (IV)
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LOWER STANDARD LIMIT x 0.5
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FORWARD VOLTAGE (IF)
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UPPER STANDARD LIMIT x 1.2
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REVERSE CURRENT (IR)
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UPPER STANDARD LIMIT x 2.0
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(1)烙铁焊接:烙铁(最高30W)尖端温度不超过300℃;焊接时间不超过3秒;焊接位置至少离胶体2毫米。
(2)浸焊:浸焊最高温度260℃;浸焊时间不超过5秒;浸焊位置至少离胶体2毫米。
引脚成形方法
(1)必需离胶体2毫米才能折弯支架。
(2)支架成形必须用夹具或由专业人员来完成。
(3)支架成形必须在焊接前完成。
(4)支架成形需保证引脚和间距与线路板上一致。
(1)注意各类器件外线的排列,以防极性装错。器件不可与发热元件靠得太近,工作条件不要超过其规定的极限。
(2)务必不要在引脚变形的情况下安装LED。
(3)当决定在孔中安装时,计算好面孔及线路板上孔距的尺寸和公差以免支架受过度的压力。
(4)安装LED时,建意用导套定位。
(5)在焊接温度回到正常以前,必须避免使LED受到任何的震动或外力。
当用化学品清洗胶体时必须特别小心,因为有些化学品对胶体表面有损伤并引起褪色如三氯乙烯、丙酮等。可用乙醇擦拭、浸渍,时间在常温下不超过3分钟。
(2)LED DISPLAYS显示器 Topr-20℃~70℃ 、 Tstg-20℃~85℃
(3)OUT-DOOR LED LAMPS 像素管 Topr-20℃~60℃ 、 Tstg-20℃~70℃
